Matching Wafer:
AB1271HWV-S-F-2xXP 1.27mm Pitch，180°，Dual Row，Foot，SMT Wafer
AB1271HWR-S-F-2xXP 1.27mm Pitch，90°，Dual Row，Foot，SMT Wafer
| General Part Info. | Category | Board To Board | ||
| Assembly Type | Wafer | |||
| Pitch (mm) | 1.27mm | |||
| Product Series | AB1271 Series | |||
| Configuration Features | Number of Rows | 2 | ||
| Number of Positions | 2x6P~2x40P | |||
| Electrical characteristics | Operating Voltage (V AC/DC) | 250 | ||
| Current(Max)(A) | 0.5 | |||
| Contact Resistance | 20mΩ Max | |||
| Insulation Resistance | 100MΩ Min | |||
| Shell characteristics | Housing Material | LCP, UL94V-0 | ||
| Color | Black | |||
| Pin Material | Phosphor Bronze | |||
| Pin Plating | Gold and Tin over Nickel | |||
| Environmental Info. | Operating Temperature Range (°C) | -40℃~105℃ | ||
| Industry Standard | UL/CUL | |||
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Pitch: 1.27mm
Pitch: 1.27mm
Pitch: 1.27mm
Pitch: 1.27mm
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